Substrate-free FOPLP technology gaining ground in advanced packaging market

Chip need for 5G, AI, and automotive applications proceeds to grow robustly, but substrates needed to approach related chips will keep on being in brief provide right up until at least 2025, which will accelerate the entry of substrate-free enthusiast-out (FO) backend alternatives, these as FOPLP ( panel stage deal), into the innovative packaging industry, in accordance to Robert Lin, basic supervisor of Manz Asia.

Lin made the remarks when speaking at the “Sophisticated Packaging Engineering Forum” recently hosted in northern Taiwan by Manz. State-of-the-art packaging has become a crucial to product differentiation for semiconductor gadgets, he reported, and IDMs, foundry residences as very well as OSATs are all rising cash bills on producing FOWLP (wafer-degree deal) solutions.

Lin observed that PCB and panel makers are also actively creating FOPLP technological innovation to slice highly developed packaging expenses, and Manz is cooperating with provide chain partners and material suppliers to boost FOPLP options and go after a a lot more prosperous foreseeable future.

At the forum, Eric Lee, director of R&D at Manz, mentioned FOPLP boasts a large space utilization price of about 95%, when compared to decrease than 85% for FOWLP, and can help a more substantial-volume, much more-effective and reduced-price tag creation of semiconductor devices.

In unique, Lee stressed, whilst rates for substantial-finish substrates are running close to those for chips, substrate-no cost FOPLP technologies will have additional potentials for mass output. The essential of the know-how lies in how to make ideal PCB layouts to achieve high-functionality electrical connectivity, in which high resolution redistribution layer (RDL) process performs q essential job. In this regard, Lee disclosed, Manz has made available total solutions.

Manz will actively increase the get to of its complete generation answers to enable consumers in distinct fields make superior general performance FOPLP generation programs, wanting to seize much more small business possibilities with constant innovation in superior packaging purposes, in accordance to Lee.

At the celebration, a senior market analyst at Yole Enhancement also launched estimates indicating that the advanced packaging industry, largely for higher-conclude 5G good cell products, automotive electronics and health care purposes, will improve from US$32.1 billion in 2021 to US$57.2 billion in 2027, for a CAGR of 10.11% through the time period.